Silicon Power 890 Electronic Bonding Potting Adhesive

Silicon Power 890 Electronic Bonding Potting Adhesive

Features :
1 Semi-fluid/fluid flow type;
2 Excellent adhesion, maintain a long-lasting sealing performance;
3 Comply with the European Union ROHS standards, through the European Union CE certification;
4 Working temperature -40~200°C.
4 Working temperature -40~200°C.

Use:
1 Protective potting of small electronic component modules;
2 Protective potting of LED photoelectric displays (screen);
3 Adhesive sealing of electronic appliances and communication equipment.

Packing specification:
300mL/pc, 24pcs/ctn.